A good way to describe the communications software architecture is to use the Open Systems Interconnection (OSI) reference model, which is shown in the next figure:

In the scope of the project the layers that are shown in the next figure, in which the DLC Communication protocol stack is considered.

Layer 1,2 and 3 from the OSI model will be considered in the project: Physical, Datalink and Network. The Physical and Datalink layers will be provided by the DLC chips manufacturers. They will also be used for modelling and network planning.

Two DLC chip manufacturers are involved in the DLC+VIT4IP project:

·        iAd Gesellschaft für Informatik,Automatisierung und Datenverarbeitung (iAd)

·        Yitran Communications LTD (Yitran)